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Rib structures in card to backplane optical high speed interconnect couplers and related sensitivity for computer motherboards

机译:卡片中的肋骨结构到背板光学高速互连耦合器及相关灵敏度的计算机主板

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The single-mode/multi-mode rib structures for high-speed optical card-to-backplane interconnects in computer motherboards are presented. In the system, we used evanescent coupling with the required known coupled power for the horizontal waveguide coupler and almost full power coupling in the vertical waveguide coupler. The rib structure parameters are varied to obtain single mode or multimode waveguides, where the rib width/height ratio and the slab height effectively control the single mode or multimode structures. For the required coupled power, the single-mode rib-waveguides require lower values of coupling length compared to that of the multimode rib- waveguides. The larger core area of SM rib structure to couple power easily from the source to the waveguide is shown. The modal dispersion effect arising in multimode waveguides is studied to improve the bit rate performance. The fabrication to prepare the polymeric optical waveguide with the conventional process by patterning with mask is shown. The experimental repeated results show that the output power variation limits within 10%. The simulated BeamPROP results for the light coupling are compared with the theoretical and experimental results.
机译:提出了用于计算机主板中的高速光卡到背板互连的单模/多模式肋结构。在系统中,我们使用了具有用于水平波导耦合器所需的已知耦合功率的渐逝耦合,并且在垂直波导耦合器中几乎全电耦合。肋结构参数变化以获得单模或多模波导,其中肋宽/高度比和板坯高度有效地控制单模或多模结构。对于所需的耦合功率,与多模肋波导相比,单模肋波导需要较低的耦合长度值。示出了SM肋结构的较大芯区域,以容易地从源耦合到波导。研究了多模波导中产生的模态分散效果,以提高比特率性能。示出了通过用掩模进行图案化制备具有常规工艺的聚合物光波导的制造。实验重复结果表明,输出功率变化限制在10%以内。与理论和实验结果进行比较了光耦合的模拟波束。

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