INTERCONNECTION BY FLIP-CHIP TECHNIQUE THROUGH OPEN-END HOLES IN CHIP

摘要

FIELD: electricity.;SUBSTANCE: acoustic unit contains integral circuit pack containing two-dimensional grid of electroconductive open-end holes made so that they go from active portion of circuit located on top side only of integral circuit pack substrate, through bottom portion of integral circuit pack, where bottom portion is bottom side of integral circuit pack substrate; and two-dimensional array of acoustic elements located on bottom side of substrate and electrically connected with electroconductive open-end holes where open-end holes are made so that to provide electric contact of active portion of integral circuit pack with two-dimensional array of acoustic elements, and in this structure, acoustic elements are cut by means of two-dimensional cutting grid.;EFFECT: better thermal and acoustic characteristics of acoustic unit, improvement and simplification of connections.;16 cl, 5 dwg