首页> 外国专利> METHOD OF PUNCTURE TRANSCUTANEOUS MICRODISCECTOMY AT L5-S1 LEVEL BY MEANS OF MECHANIC DECOMPRESSOR

METHOD OF PUNCTURE TRANSCUTANEOUS MICRODISCECTOMY AT L5-S1 LEVEL BY MEANS OF MECHANIC DECOMPRESSOR

机译:机械降压装置在L5-S1级穿刺穿刺显微切割的方法

摘要

FIELD: medicine.;SUBSTANCE: invention relates to field of medicine, namely to neurosurgery and can be applied in treatment of degenerative-dystrophic diseases of spine, complicated by hernia-formation at L5-S1 level. Essence of method lies in puncture transcutaneous microdiscectomy at L5-S1 level by means of mechanical decompressor with curved guide-needle. Guide-needle is preliminarily curved in point which is at 3 cm distance from distal needle end at angle 35-40°. It is introduced transcutaneously at angle 35-50° to body surface in frontal plane, with lateral inclination and 8-12 cm indent from the line of spinous processes. In the course of needle movement its trajectory is manipulated. Posterior upper axis of ilium is passed round. After that, intervertebral disc is approached parallel to closing plates and punctured in the centre of nucleus pulposus. Application of claimed invention makes it possible to improve, simplify and accelerate puncture access into intervertebral disc L5-S1, thus reduce operation time, more accurately puncture intervertebral disc parallel to closing plates, remove larger amount of nucleus pulposus.;EFFECT: removal of large amount of nucleus pulposus ensures reduction of intervertebral disc volume, reduction of intradisc pressure and elimination of discoradicular and (or) discomedullary conflict.;15 dwg, 1 ex
机译:技术领域本发明涉及医学领域,即神经外科,可用于治疗脊柱变性营养不良性疾病,并伴有L5-S1水平的疝气形成。该方法的实质在于借助带有弯曲导针的机械减压器在L5-S1水平进行穿刺经皮显微椎间盘切除术。导针的弯曲角度是预先弯曲的,该角度与远端针头之间的距离为3-40毫米,夹角为35-40°。以与身体表面在前额平面成35-50°的角度经皮引入,其横向倾斜度与棘突线相距8-12厘米。在针头运动的过程中,其轨迹被操纵。 lium骨的后上轴绕过。此后,将椎间盘平行于封闭板并刺入髓核中心。要求保护的发明的应用使得可以改善,简化和加速穿刺进入椎间盘L5-S1,从而减少手术时间,更准确地穿刺平行于封闭板的椎间盘,去除大量髓核。一定数量的髓核可确保减少椎间盘体积,降低椎间盘内压力并消除椎间盘和(或)椎间盘冲突。; 15 dwg,1 ex

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