Method for separating round wafer into rectangular chips for display panel of mobile telephone, involves forming horizontal parting lines vertical to vertical parting lines, from one edge to other edge of platen

摘要

The method involves forming a center parting line (2-1) in a plan platen (1) along vertical parting lines (2-6-1-8,2-7-1-6,2-7-1-10,2-8 -1-4) by laser, such that the platen is divided and two rectilinear edge portions are formed along the center parting line. The horizontal parting lines (2-2-2-5) are formed from one edge to other edge of the platen at preset intervals, to divide the rectilinear edge portions into several portions. All the parting lines (2-2-2-5) are formed vertical to the vertical parting lines such that platen is divided into several single platens.