Vapor deposition of substrate within vacuum chamber, by evaporating a material in crucible by electron beam so that vaporous coating material is reflected on surface of vaporization material and producing plasma by arc discharge on surface

摘要

The method for vapor deposition of a substrate (2) within a vacuum chamber (1), comprises evaporating a material in an open crucible (3a, 3b) by evaporated electron beam (6) provided by an electron accelerator (5) so that a vaporous coating material propagating on the substrate is spatially reflected over the surface of the vaporization material, and producing a plasma by a diffuse arc discharge on the surface of the vaporization material of each crucible in the process chamber for ionization and excitation energy of the evaporated coating material. The method for vapor deposition of a substrate (2) within a vacuum chamber (1), comprises evaporating a material in an open crucible (3a, 3b) by evaporated electron beam (6) provided by an electron accelerator (5) so that a vaporous coating material propagating on the substrate is spatially reflected over the surface of the vaporization material, and producing a plasma by a diffuse arc discharge on the surface of the vaporization material of each crucible in the process chamber for ionization and excitation energy of the evaporated coating material. Each vaporization material containing the separate crucible for forming the diffuse arc discharge is assigned with a separate anode. A cathode is electrically connected to the vaporization material via a power supply. The vaporous coating material facing region is heated to a temperature above the melting temperature of the vaporization material in each anode. The region is heated by an electron beam, current flow, and by a radiation heater. The anode is: disposed above the surface of the vaporization material; and positioned such that a drop into the dripping from it in the condensate or the crucible is not possible. The surface of the vaporization material of each crucible is formed with a maximum size of 200 cm 2. The vaporization material is replenished during evaporation. The vaporous coating material facing region of the anode is formed with a maximum area of 200 cm 2. The heated anode region is heated to a temperature at which the vaporous coating material is not more condensed.