首页> 外国专利> Method for supporting binding of chips to electronic device such as microcontroller, involves creating unique chip-specific parameter in chip, reading the parameter and sending characteristics size of chip, to electronic device

Method for supporting binding of chips to electronic device such as microcontroller, involves creating unique chip-specific parameter in chip, reading the parameter and sending characteristics size of chip, to electronic device

机译:支持芯片与电子设备(例如微控制器)绑定的方法,包括在芯片中创建唯一的芯片特定参数,读取参数并将芯片的特征尺寸发送给电子设备

摘要

The method involves creating a unique chip-specific parameter in a chip (10), reading the chip-specific parameter within of the chip and sending the characteristics size of the chip, to an electronic device (50). The individual chip characteristic size is generated using the physical unclonable functions or by using non-volatile memory values. The individual chip characteristic size is programmed in programmable elements (30) of the chip by the data received from the chip. Independent claims are included for the following: (1) chip; and (2) electronic device.
机译:该方法包括在芯片(10)中创建唯一的芯片特定参数,读取芯片内的芯片特定参数,并将芯片的特征尺寸发送给电子设备(50)。使用物理不可克隆功能或使用非易失性存储器值来生成各个芯片的特征尺寸。通过从芯片接收的数据在芯片的可编程元件(30)中编程各个芯片特征尺寸。包括以下方面的独立权利要求:(1)芯片; (2)电子设备。

著录项

  • 公开/公告号DE102010047186A1

    专利类型

  • 公开/公告日2012-04-05

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20101047186

  • 发明设计人 JANKE MARCUS;LAACKMANN PETER DR.;

    申请日2010-09-30

  • 分类号G06F21/20;G06F21/02;G06F11/30;G06Q10/00;

  • 国家 DE

  • 入库时间 2022-08-21 17:05:21

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号