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ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems

召开年：2013
召开地：Burlingame, CA(US)
出版时间：-

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1.BASIC STUDY ON TRANSIENT TEMPERATURE RESPONSE OF PAPERS IN A THERMAL TRANSFER PRINTER

机译：热转印打印机中纸张瞬态温度响应的基础研究
- 作者：Koichi Hi rose;Takashi Fukue;Fumiya Nakagawa;Risa Ito;Tomoko Wauke;Hisashi Hoshino;Hirotoshi Terao
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
2.DESIGN AND CONTROL OF THE IBM POWER 775 SUPERCOMPUTER WATER CONDITIONING UNIT

机译：IBM POWER 775超级计算机水处理单元的设计和控制
- 作者：Michael J. Ellsworth Jr.;Frank Cascio;Randy J. Zoodsma;Eileen Behrendt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
3.A COMPARISON OF METHODS TO MEASURE THE THERMAL DIFFUSIVITY OF ANISOTROPIC GRAPHITE HEAT SPREADERS

机译：各向异性石墨传热器热扩散率测量方法的比较
- 作者：Rick Beyerle;Ryan Wayne;Martin Smalc;R. A. Reynolds Ⅲ
- 会议名称：《》 | 2014年
- Thermal diffusivity;
- Angstrom;
- LaserPIT;
- graphite;
- anisotropy;
- measurement system analysis;
- heat spreader;
4.ADVANCED NATURAL CONVECTION COOLING DESIGNS FOR LED BULB SYSTEMS

机译：LED灯泡系统的先进自然对流冷却设计
- 作者：James Petroski
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- LED;
- cooling;
- natural convection;
- heat sink;
- chimney;
- electronics cooling;
- A19;
- bulb;
5.ANALYSIS OF SINGLE-PHASE MULTI-LAYER HEAT SINKS USING A POROUS MEDIA APPROACH: INFLUENCE OF SPATIALLY VARYING POROSITY

机译：多孔介质方法的单相多层热沉降分析：空间变化孔隙度的影响
- 作者：John J. Podhiny;Alfonso Ortega
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
6.MODIFIED MODEL FOR IMPROVED FLOW REGIME PREDICTION IN INTERNALLY-GROOVED TUBES

机译：内沟槽管的改进流域预测的修正模型
- 作者：Darin J. Sharar;Nicholas R. Jankowski;Avram Bar-Cohen
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
7.A HIERARCHICAL FRAMEWORK FOR THERMAL MODELLING OF ELECTRONIC DEVICES: FROM ATOMS TO CHIPS

机译：电子设备热建模的分层框架：从原子到芯片
- 作者：David A. Romero;Elham Pakseresht;Daniel Sellan;Aydin Nabovati;Cristina Amon
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
8.PREDICTION OF HOT AISLE PARTITION AIRFLOW BOUNDARY CONDITIONS

机译：热通道分隔气流边界条件的预测
- 作者：Zhihang Song;Bruce T. Murray;Bahgat Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
9.THERMODYNAMIC MODELING OF DATA CENTER COOLING SYSTEMS

机译：数据中心冷却系统的热力学建模
- 作者：A. P. Wemhoff;M. del Valle;K. Abbasi;A. Ortega
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
10.DYNAMICALLY CONTROLLED LONG DURATION OPERATION OF A HIGHLY ENERGY EFFICIENT CHILLER-LESS DATA CENTER TEST FACILITY

机译：高效节能的无数据中心测试设备的动态控制长时间运行
- 作者：Milnes P. David;Pritish R. Parida;Mark D. Schultz;Robert E. Simons;Michael Gaynes;Roger Schmidt;Timothy J. Chainer
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
11.DYNAMIC ANALYSIS OF HYBRID COOLING DATA CENTERS SUBJECTS TO THE FAILURE OF CRAC UNITS

机译：CRAC单元故障后的混合冷却数据中心动态分析
- 作者：Tianyi Gao;Roger Schmidt;Emad Samadiani;Bahgat Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
12.EFFECT OF COLD AISLE CONTAINMENT LEAKAGE ON FLOW RATES AND TEMPERATURES IN A DATA CENTER

机译：数据中心中的冷通道泄漏对流量和温度的影响
- 作者：Sami A. Alkharabsheh;Saurabh K. Shrivastava;Bahgat G. Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
13.RELATIONSHIPS BETWEEN SUPPLY FLOW RATE OF SMALL COOLING FANS AND PRESSURE DROP CHARACTERISTICS IN ELECTRONIC ENCLOSURE

机译：电子外壳中小冷却风扇的供气流量与压降特性的关系
- 作者：Takashi Fukue;Masaru Ishizuka;Tomoyuki Hatakeyama;Koichi Hirose;Katsuhiro Koizumi
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
14.EFFECT OF MENISCUS RECESSION ON THE EFFECTIVE PORE RADIUS AND CAPILLARY PUMPING OF COPPER METAL FOAMS

机译：弯月球退缩对铜泡沫的有效孔隙半径和毛细管泵吸的影响
- 作者：Mahmood R.S. Shirazy;Luc G. Frechette
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
15.EXPERIMENTAL STUDY OF THE CONVECTIVE HEAT TRANSFER FROM A GEOMETRICALLY SCALED UP 2D IMPINGING SYNTHETIC JET

机译：几何尺度二维撞击合成射流对流换热的实验研究。
- 作者：Luis Silva;Alfonso Ortega;Isaac Rose
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
16.COMPARATIVE NUMERICAL ANALYSIS OF ANGLED BRANCHING MICROCHANNEL HEAT SINK

机译：有角度分支微通道热沉的比较数值分析
- 作者：Cheng Chen;Emad Samadiani;Bahgat Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
17.A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

机译：基于电容的使用电极结网格表征介电界面的技术
- 作者：Stephen H. Taylor;Suresh V. Garimella
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
18.IMPROVED COOLING OF ELECTROMAGNETICS BY DIRECTED AIRFLOW

机译：定向气流改善了电磁学的冷却
- 作者：Scott Downing;Adam Fain;Pradip Majumdar
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
19.IMPROVED ZONAL MODEL FOR DATA CENTER ANALYSIS

机译：用于数据中心分析的改进的区域模型
- 作者：Zhihang Song;Bruce T. Murray;Bahgat Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
20.Effects of Non-Uniform Heating on Two-Phase Flow through Microchannels

机译：非均匀加热对微通道两相流的影响
- 作者：Susan N. Ritchey;Justin A. Weibel;Suresh V. Garimella
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
21.COMPARATIVE THERMAL AND ENERGY ANALYSIS OF A HYBRID COOLING DATA CENTER WITH REAR DOOR HEAT EXCHANGERS

机译：带有后门换热器的混合冷却数据中心的热能比较分析
- 作者：Tianyi Gao;Bahgat Sammakia;Emad Samadiani;Roger Schmidt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- hybrid cooling;
- rear door heat exchanger;
- energy consumption;
22.A NUMERICAL STEADY STATE AND DYNAMIC STUDY IN A DATA CENTER USING CALIBRATED FAN CURVES FOR CRACS AND SERVERS

机译：针对CRACS和服务器的使用校准风扇曲线的数据中心的数值稳态和动态研究
- 作者：Sami A. Alkharabsheh;Michael Ellsworth;Bahgat Sammakia;Milnes David;Saurabh Shrivastava;Roger Schmidt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
23.ANALYSIS AND CHARACTERIZATION OF THERMAL EXPANSION-MATCHED WICK-BASED MULTI-CHIP PASSIVE HEAT SPREADERS IN STATIC AND DYNAMIC ENVIRONMENTS

机译：静态和动态环境中基于热膨胀匹配的Wick多芯片被动传热器的分析和表征
- 作者：David H. Altman;Anurag Gupta;Thomas E. Dubrowski Jr.;Darin J. Sharar;Nicholas R. Jankowski;Mark T. North
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- heat spreader;
- heat pipe;
- vapor chamber;
- thermal resistance;
- sintered powder wick;
- high-g environment;
24.COOLING ENERGY REDUCTION DURING DYNAMICALLY CONTROLLED DATA CENTER OPERATION

机译：动态控制数据中心运行期间的冷却能耗降低
- 作者：Pritish R. Parida;Mark D. Schultz;Timothy J. Chainer;Milnes P. David
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
25.OPEN AND CONTAINED COLD AISLE EXPERIMENTALLY VALIDATED CFD MODEL IMPLEMENTING CRAC AND SERVER FAN CURVES FOR A DATA CENTER TEST LABORATORY

机译：实施数据中心测试实验室的CRAC和服务器风扇曲线的开放和包含冷通道的经过实验验证的CFD模型
- 作者：SamiA. Alkharabsheh;Bharathkrishnan Muralidharan;Mahmoud Ibrahim;Saurabh K. Shrivastava;Bahgat G. Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
26.PARAMETRIC STUDY ON THERMAL AND HYDRAULIC PERFORMANCE OF A HYBRID DOUBLE-SIDE MICRO-JET COOLING SYSTEM

机译：混合双侧微射流冷却系统热工和液压性能的参数研究
- 作者：Sun-min Kim;Kwang-Yong Kim
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
27.HEAT TRANSFER PERFORMANCE OF AN AIR-ASSISTED IMPINGING WATER JET UNDER A FIXED PUMPING POWER CONSTRAINT

机译：固定泵功率约束下空气辅助撞击水射流的传热性能
- 作者：Daniel Trainer;Sung Jin Kim
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
28.Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)

机译：二维3D集成电路（3D IC）的热性能的实验测量
- 作者：Leila Choobineh;Trent Uehling;Nick Vo;Ankur Jain
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
29.INTEGRATION OF A MULTIPLE-CONDENSER LOOP HEAT PIPE IN A COMPACT AIR-COOLED HEAT SINK

机译：将多冷凝器热管集成到紧凑的空冷式热沉中
- 作者：H. Arthur Kariya;Daniel F. Hanks;Wayne L. Staats;Nicholas A. Roche;Martin Cleary;Teresa B. Peters;John G. Brisson;Evelyn N. Wang
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
30.A FLOW VISUALIZATION STUDY ON THE TEMPERATURE OSCILLATIONS INSIDE A LOOP HEAT PIPE WITH FLAT EVAPORATOR

机译：带蒸发器的热管内温度振荡的流动可视化研究。
- 作者：Dongchuan Mo;Guansheng Zou;Shushen Lu;L. Winston Zhang
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
31.NOVEL IMMERSION COOLING TECHNIQUE FOR A 3D CHIP STACK

机译：3D芯片堆栈的新型浸入冷却技术
- 作者：Ashish Sinha;Krishna Kota;Pablo Hidalgo;Yogendra Joshi;Ari Glezer
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
32.THERMAL PERFORMANCE OF A SILICON-BASED MULTIPLE MICRO-JET IMPINGEMENT HEAT SINK

机译：基于硅的多个微射流冲击热沉的热性能
- 作者：Afzal Husain;Jun-Hee Kim;Kwang-Yong Kim
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
33.A METHOD FOR FAILURE ANALYSIS FOR DEVICES WITH SIMULTANEOUS IMAGING OF ELECTRON EMISSION AND NEAR IR THERMOREFLECTANCE

机译：电子发射与近红外热反射同时成像的设备故障分析方法
- 作者：Kazuaki Yazawa;James Christofferson;Dustin Kendig;Ali Shakouri
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
34.COMBINING COMPUTATIONAL FLUID DYNAMICS (CFD) AND FLOW NETWORK MODELING (FNM) FOR DESIGN OF A MULTI-CHIP MODULE (MCM) COLD PLATE

机译：结合计算流体动力学（CFD）和流网络建模（FNM）设计多芯片模块（MCM）冷板
- 作者：John Fernandes;Chris Aldham;Saeed Ghalambor;Dereje Agonafer;Akhil Docca;Evan Chenelly;Benson Chan;Michael Ellsworth Jr.
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- CFD;
- FNM;
- liquid cooling;
- cold plate;
- MCM;
35.A FIELD INVESTIGATION INTO THE LIMITS OF HIGH-DENSITY AIR-COOLING

机译：高密度空气冷却极限的现场调查
- 作者：Michael K Patterson;Randall Martin;J. Barr von Oehsen;Jim Pepin;Yogendra Joshi;Vaibhav K Arghode;Robin Steinbrecher;Jeff King
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
36.DIRECT LIQUID COOLING OF HIGH FLUX LED SYSTEMS: HOT SPOT ABATEMENT

机译：高通量LED系统的直接液体冷却：热点消除
- 作者：Enes Tamdogan;Mehmet Arik;M. Baris Dogruoz
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Light emitting diodes;
- LEDs;
- Liquid cooling;
- thermal management;
- electronics cooling;
- design optimization;
37.NEW METHOD FOR EVALUATING HEAT TRANSFER MATERIAL

机译：一种评估传热材料的新方法
- 作者：Yasuhiro Saito;Yuuki Tuji;Hiroyuki Emoto;Takanori Komuro
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
38.Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in MicroChannel Flows

机译：微通道流中三维液相气相边界定量解析的诊断技术
- 作者：Ravi S. Patel;Suresh V. Garimella
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
39.INVESTIGATION ON THE MULTIPLE JET IMPINGEMENT HEAT TRANSFER USING AL2O3-WATER NANOFLUID

机译：AL2O3-水纳米流体对多射流冲击传热的研究
- 作者：Caner SENKAL;Shuichi TORII
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
40.Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling

机译：用于高热通量冷却的高填充分数热电模块的设计
- 作者：Ram Ranjan;Joseph E. Turney;Chuck E. Lents
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
41.DEVELOPMENT OF PLATE HEAT PIPES FOR THE THERMAL MANAGEMENT OF POWER ELECTRONICS

机译：电力电子热管理板式热管的研制
- 作者：Yoshiyuki Abe;Yoshihiko Maeda;Akira Nakajima;Makoto Shimose
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
42.DESIGN OF COST-EFFECTIVE WATER-COOLED PINFIN HEATSINKS

机译：高性价比的水冷平纹热缩胶的设计
- 作者：Keisuke Horiuchi;Atsuo Nishihara;Kazuyuki Sugimura
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Optimization;
- Pinfin heatsink;
43.TIM SELECTION FOR AN IGBT COLD PLATE USING EXPERIMENTAL AND NUMERICAL MODELING

机译：利用实验和数值模拟对IGBT冷板进行TIM选择
- 作者：John F. Maddox;Roy W. Knight;Sushil H. Bhavnani
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
44.LIQUID COOLED HIGH POWER AEROSPACE ELECTRONICS FLUID CHANNEL LAYOUT DESIGN STRATEGY BASED ON ANALYTICAL CALCULATION

机译：基于解析计算的液态冷高功率航空电子流体通道布局设计策略
- 作者：Frank Fan Wang
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
45.CFD MODELING OF INDIRECT/DIRECT EVAPORATIVE COOLING UNIT FOR MODULAR DATA CENTER APPLICATIONS

机译：模块化数据中心应用的直接/直接蒸发冷却单元的CFD建模
- 作者：Betsegaw Gebrehiwot;Nikhil Dhiman;Kasturi Rajagopalan;Dereje Agonafer;Naveen Kannan;James Hoverson;Mike Kaler
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
46.BENEFIT OF COLD AISLE CONTAINMENT DURING COOLING FAILURE

机译：冷却故障期间保持冷通道的好处
- 作者：Saurabh K. Shrivastava;Mahmoud Ibrahim
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
47.ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS

机译：供电和冷却数据中心的热电联产系统的能源性能评估
- 作者：Dale C. Ringham;Hamza Salih Erden;Dan J. Rice;H. Ezzat Khalifa;Brian S. Granetz;Roger R. Schmidt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
48.ESTIMATION METHOD OF TEMPERATURE DISTRIBUTION AND ENERGY SAVING TECHNOLOGY OF AIR CONDITIONER IN DATA CENTER

机译：数据中心空调温度分布及节能技术的估算方法
- 作者：Kentaroh SANO;Yoshihiro KONDO;Hayato SHIMIZU;Takayuki FUJIMOTO
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Data center;
- Air conditioning;
- energy consumption;
- simulation;
- CFD;
49.HEAT TRANSFER DUE TO THE IMPINGEMENT OF AN AXISYMMETRIC SYNTHETIC JET EMANATING FROM A CIRCULAR ORIFICE: A NUMERICAL INVESTIGATION OF A CANONICAL GEOMETRY

机译：从圆孔传出轴对称合成射流引起的传热：规范几何的数值研究
- 作者：M. Ebrahim;L. Silva;A.Ortega
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
50.A STATISTICAL APPROACH TO REAL-TIME UPDATING AND AUTOMATIC SCHEDULING OF PHYSICAL MODELS

机译：物理模型实时更新和自动调度的统计方法
- 作者：Huijing Jiang;Xinwei Deng;Vanessa Lopez;Hendrik Hamann
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
51.IMPROVING THE THERMAL PERFORMANCE OF A FORCED CONVECTION AIR COOLED SOLUTION - PART 2: EFFECT ON SYSTEM-LEVEL PERFORMANCE

机译：改善强制对流空气冷却解决方案的热性能-第2部分：对系统级性能的影响
- 作者：John Edward Fernandes;Saeed Ghalambor;Richard Eiland;Dereje Agonafer;Veerendra Mulay
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Server;
- back plate;
- interfacial pressure;
- TIM performance;
- power consumption;
52.IMPROVING THE THERMAL PERFORMANCE OF A FORCED CONVECTION AIR COOLED SOLUTION - PART 1: MODIFICATION OF HEAT SINK ASSEMBLY

机译：改善强制对流空气冷却溶液的热性能-第1部分：热沉组件的改性
- 作者：Saeed Ghalambor;John Edward Fernandes;Veerendra Mulay;Dereje Agonafer
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Server;
- back plate;
- interfacial pressure;
- TIM performance;
- mechanical analysis;
53.EFFECT OF FIN INTERRUPTIONS ON NATURAL CONVECTION HEAT TRANSFER FROM A RECTANGULAR INTERRUPTED SINGLE-WALL

机译：鳍状中断对矩形夹层单壁自然对流换热的影响
- 作者：Golnoosh Mostafavi;Mehran Ahmadi;Majid Bahrami
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
54.A PARAMETRIC NUMERICAL STUDY IN CYLINDRICAL OBLIQUE FIN MINICHANNEL

机译：圆柱斜鳍微通道的参数数值研究
- 作者：Yan Fan;Poh Seng Lee;Li-Wen Jin;Beng Wah Chua;Na-Si Mou;Mrinal Jagirdar
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
55.ANTICIPATORY THERMOELECTRIC COOLING OF A TRANSIENT GERMANIUM HOTSPOT

机译：瞬态锗热斑的预测热电冷却
- 作者：Michael Manno;Peng Wang;Avram Bar-Cohen
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- Transient;
- Hotspot;
- Thermoelectric Cooling;
- Self Cooling;
56.COOLING OF A MANY-CORE MULTIPROCESSOR: EXPERIMENTAL RESULTS FOR OLTP WORKLOADS

机译：多核多处理器的冷却：OLTP工作负载的实验结果
- 作者：Krishnamachar Sreenivasan
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
57.ENHANCING HEAT TRANSFER IN A COLD PLATE, INSERTS VS. NANOFLUIDS: APPLICATION TO IT SERVERS

机译：VS.增强冷板中的传热。 NANOFLUIDS：应用于IT服务器
- 作者：Amrid Mammeri;Farid Bakir;Smaine Kouidri;Lionel Coutancier
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
58.STEADY AND TRANSIENT HEAT TRANSFER ANALYSIS OF THE MICROPROCESSOR SYSTEM USING ONE-DIMENSIONAL THERMAL NETWORK

机译：基于一维热网络的微处理机系统稳态和瞬态传热分析
- 作者：Koji Nishi;Tomoyuki Hatakeyama;Masaru Ishizuka
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
59.ANALYTIC OPTIMIZATION OF POROUS MEDIUM HEAT SINKS FOR ENERGY EFFICIENCY AND MINIMUM MASS

机译：多孔介质热沉的能量效率和最小质量的分析优化
- 作者：NinadTrifale;Eric Nauman;Kazuaki Yazawa
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
60.EXPERIMENTAL INVESTIGATION OF THE EFFECT OF SYNTHETIC JETS IN MINICHANNELS WITH SUBCOOLED BOILING FLOW

机译：过冷沸腾流道对微型通道合成射流影响的实验研究
- 作者：David M. Sykes;Andrew L. Carpenter;Gregory S. Cole
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
61.EFFICIENT IMPLEMENTATION OF POTENTIAL-FLOW AIRFLOW PREDICTION FOR DATA CENTERS

机译：数据中心的潜在流量预测的有效实现
- 作者：Christopher M. Healey;James W. VanGilder;Xuanhang (Simon) Zhang
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
62.DATA CENTER AIRFLOW PREDICTION WITH AN ENHANCED POTENTIAL FLOW MODEL

机译：具有增强势能模型的数据中心流量预测
- 作者：James W. VanGilder;Xuanhang (Simon) Zhang;Christopher M. Healey
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
63.MAXIMIZING DATA CENTER ENERGY EFFICIENCY BY UTILIZING NEW THERMAL MANAGEMENT AND ACOUSTIC CONTROL METHODOLOGY

机译：通过使用新的热管理和声学控制方法来最大程度地提高数据中心的能源效率
- 作者：Jason A. Matteson;Aparna Vallury;Billy Medlin
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
- data center energy;
- acoustics;
- chassis power;
- energy modes;
- thermal algorithms;
- thermal management and controls;
64.ROOM-LEVEL TRANSIENT CFD MODELING OF RACK SHUTDOWN

机译：机架停机的全层瞬态CFD建模
- 作者：Hamza Salih Erden;H. Ezzat Khalifa;Roger R. Schmidt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
65.APPLICATIONS OF COLD PLATE UNITS WITH MICRO-CHANNEL FOR COOLING ELECTRONICS

机译：微通道冷板单元在冷却电子中的应用
- 作者：Koichi Mashiko;Masataka Mochizuki;Kazuhiko Goto;Makoto Takahashi;Masahiro Matsuda;Yasuhiro Horiuchi;Tien Nguyen
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
66.DATA CENTER TRENDS TOWARD HIGHER AMBIENT INLET TEMPERATURES AND THE IMPACT ON SERVER PERFORMANCE

机译：数据中心趋向更高的环境入口温度及其对服务器性能的影响
- 作者：Aparna Vallury;Jason Matteson
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
67.IMPACT OF COLD AISLE CONTAINMENT ON THERMAL PERFORMANCE OF DATA CENTER

机译：冷通道遏制对数据中心热性能的影响
- 作者：Bharathkrishnan Muralidharan;Saurabh K. Shrivastava;Mahmoud Ibrahim;Sami A. Alkharabsheh;Bahgat G. Sammakia
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
68.FABRICATION OF HEAT PIPES ON AN ACRYLIC RESIN BOARD

机译：丙烯酸树脂板上的热管制造
- 作者：Yasushi Koito;Hiroyuki Maehara;Toshio Tomimura
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
69.OPTIMIZATION ALGORITHMS FOR ENERGY-EFFICIENT DATA CENTERS

机译：节能数据中心的优化算法
- 作者：Hendrik F. Hamann
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
70.CORRELATION BETWEEN BEHAVIORS OF THE VAPOR BUBBLES AND THE CHARACTERISTICS OF THE HEAT TRANSFER OVER THE HEATED SURFACE ON MEB

机译：汽泡加热行为与MEB加热表面传热特性的相关性
- 作者：Takahito SAIKI;Ichiro UENO;Tomohiko OSAWA;Chungpyo HONG
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
71.MEASURED-TEMPERATURE INTERPOLATION AND VISUALIZATION FOR DATA CENTERS

机译：数据中心的实测温度插值和可视化
- 作者：Xuanhang (Simon) Zhang;Zachary R. Sheffer;Christopher M. Healey;James W. VanGilder
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
72.EXPERIMENTAL MEASUREMENT OF SERVER THERMAL EFFECTIVENESS FOR COMPACT TRANSIENT DATA CENTER MODELS

机译：紧凑型瞬态数据中心模型的服务器热效率的实验测量
- 作者：James W. VanGilder;Xuanhang (Simon) Zhang;Zachary M. Pardey;Christopher Healey
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
73.TRANSIENT THERMAL RESPONSE OF SERVERS THROUGH AIR TEMPERATURE MEASUREMENTS

机译：服务器通过空气温度测量的瞬态热响应
- 作者：Hamza Salih Erden;H. Ezzat Khalifa;Roger R. Schmidt
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
74.COMPACT MODELING OF DATA CENTER AIR CONTAINMENT SYSTEMS

机译：数据中心空调系统的紧凑建模
- 作者：Xuanhang (Simon) Zhang;Christopher M. Healey;James W. VanGilder;Zachary R. Sheffer
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
75.STUDY ON THE FLOW AND HEAT TRANSFER CHARACTERISTICS OF PULSATING HEAT PIPE WITH ASYMMETRIC CONFIGURATION

机译：不对称结构脉动热管流动和传热特性的研究
- 作者：Gi Hwan Kwon;Sung Jin Kim
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
76.THERMAL TRANSPORT PHENOMENON IN CIRCULAR PIPE FLOW USING DIFFERENT NANOFLUIDS

机译：不同纳米流体在圆管中的热输运现象
- 作者：Shuichi Torii
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
77.NUMERICAL CALCULATION OF THE PULSE COMPRESSION OF ULTRASHORT PULSE LASER LIGHT BY MEANS OF THE THERMOREFLECTANCE OF SIC SUBSTRATE

机译：利用Sic基质热反射率数值计算超短脉冲激光的脉冲压缩。
- 作者：Hong Duc DOAN;Kazuyoshi FUSHINOBU
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
78.IMPACT OF MATERIAL PROPERTIES ON COOLING COP OF INTEGRATED THERMOELECTRIC MICROCOOLERS

机译：材料性能对集成热电微冷却器冷却COP的影响
- 作者：Yee Rui Koh;Kazuaki Yazawa;Ali Shakouri
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
79.ON THE THERMAL MANAGEMENT CHALLENGES IN NEXT GENERATION HANDHELD DEVICES

机译：下一代手持设备的热管理挑战
- 作者：Guy R Wagner;William Maltz
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年
80.ESTIMATION OF HEAT GENERATION FROM POWER SI MOSFET USING ELECTRO-THERMAL ANALYSIS

机译：利用电热分析估算功率SI MOSFET的热量
- 作者：Risako Kibushi;Tomoyuki Hatakeyama;Masaru Ishizuka
- 会议名称：《ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems》 | 2014年