首页> 外国专利> Arrangement for measuring current value in galvanic primary conductor, has current measuring circuit arranged on top face of circuit carrier, where edges of top and bottom faces of circuit carrier are rounded

Arrangement for measuring current value in galvanic primary conductor, has current measuring circuit arranged on top face of circuit carrier, where edges of top and bottom faces of circuit carrier are rounded

机译:用于测量电初级导体中的电流值的装置,在电路载体的顶面上布置有电流测量电路,电路载体的顶面和底面的边缘呈圆形

摘要

The arrangement (1100) has a circuit carrier (1200) comprising a top face (1210) that is opposite to a bottom face (1220), and a current measuring circuit (230) arranged on a top face of the circuit carrier, where the edges of the top and bottom faces of the circuit carrier are rounded. The circuit carrier is made of electrical conductive material or semiconductor material. An insulation element (300) is arranged on the bottom face of the circuitry carrier and provided above a primary conductor (400).
机译:装置(1100)具有:电路载体(1200),其包括与底表面(1220)相对的顶表面(1210);以及电流测量电路(230),其布置在电路载体的顶表面上,其中电路载体的顶面和底面的边缘是圆形的。电路载体由导电材料或半导体材料制成。绝缘元件(300)布置在电路载体的底面上并且设置在初级导体(400)上方。

著录项

  • 公开/公告号DE102010063961A1

    专利类型

  • 公开/公告日2012-06-28

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号DE20101063961

  • 发明设计人 WEIS ROLAND;

    申请日2010-12-22

  • 分类号G01R15/20;G01R17;G01R19;

  • 国家 DE

  • 入库时间 2022-08-21 17:05:08

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