Method for producing solderable, electrical conductive structures on substrate surface at backside of laser-fired-contact cell, involves treating metal-containing composition in order to deposit metal as structure on substrate surface

摘要

The method involves applying a metal-containing composition to a substrate surface. The metal-containing composition is treated in order to deposit metal i.e. aluminum, as a solderable, electrically conductive structure on the substrate surface. The metal-containing composition is selected from a group consisting of silver, nickel, copper, cobalt, gold, ruthenium, rhodium, palladium and tin-containing compound. The metal-containing composition is composed of a metal salt containing composition such as silver carboxylate or silver nitrate.