Flexible, multi-layer circuit substrate manufacturing method, involves connecting functional films with each other by region-wise deflection of carrier film and region-wise contacting of films and adhesive layer by laminating movement

摘要

The method involves aligning a functional film (70) i.e. film-based circuit board, and another functional film (80) e.g. copper structure, at predetermined distance from each other in an alignment position. Relative movement between the films is monitored by an optical detection unit (40) e.g. video camera, based on respective alignment marks of the films. The films are connected with each other by region-wise deflection of a carrier film (32) and by region-wise contacting of the films and an adhesive layer (90) attached to one of the films by laminating movement. An independent claim is also included for a device for manufacturing a flexible, multi-layer circuit substrate.