Semiconductor device, has main housing provided on base plate, support secured at housing, and projection formed on inner wall of housing, where head-side surface of projection is separated from lower surface of cover

摘要

The device has a main housing (12) provided on a base plate (10), and a projection (14) formed on an inner wall of the housing. A semiconductor element (18) is arranged on the base plate in the housing, and silicone gel (26) is injected into the housing. A cover (28) is attached to the housing and encapsulates the element and the gel. A support (30) comprises a bottom end touching the base plate and a head end touching a lower surface of the cover. The support is secured at the housing, and a head-side surface of the projection is separated from a lower surface of the cover.