Composition, useful for heat dissipation in electronic devices, comprises a base material with aromatic hydrocarbons including hydroxyl groups with double bonds on the basis of benzene, an opaque resin base material and a solvent

摘要

Composition for heat dissipation, comprises a base material (10) with aromatic hydrocarbons including hydroxyl groups with double bonds on the basis of benzene, an opaque resin base material (20) and a solvent (30), where the base material is added to opaque resin base material and solvent, and the mixture is applied on the surface of an object to be cooled in order to support the heat dissipation by the double bond shift and form a resonance structure, in which the double bonds return to their original position during the heat dissipation.