首页> 外国专利> COBALT PLATED COPPER FINE POWER, CONDUCTIVE PASTE PRODUCED BY USING THE SAME, AND METHOD OF PRODUCING THE SAME

COBALT PLATED COPPER FINE POWER, CONDUCTIVE PASTE PRODUCED BY USING THE SAME, AND METHOD OF PRODUCING THE SAME

机译:钴镀铜微粉功率,使用该铜粉产生的导电性糊剂及其制备方法

摘要

PROBLEM TO BE SOLVED: To provide a material smaller in specific resistance as an electrode material of a laminated ceramic capacitor, in particular, copper fine powder having a higher TMA value for allowing to set the particle size of conductor particles in a sintering paste for configuring an inner electrode to the order of 0.1-1 μmφ in order to prevent a short circuit among laminated electrodes and allowing to alternately stack the electrodes and dielectrics of the laminated ceramic capacitor in order to simultaneously sinter them at a high temperature.;SOLUTION: Cobalt coated copper fine power has a cobalt layer on a surface of the copper fine powder formed by disproportionation reaction. In a method of producing the cobalt coated copper fine powder, the copper fine powder is formed by disproportionation reaction of cuprous oxide, the copper fine powder is plated with palladium (Pd) by electroless displacement plating, and cobalt is coated on it by electroless plating.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:为了提供比电阻小的材料作为叠层陶瓷电容器的电极材料,特别是,具有较高的TMA值的铜细粉,以允许设定用于构造的烧结浆料中的导体颗粒的粒径。内部电极的尺寸约为0.1-1μmφ,以防止层叠电极之间的短路,并允许交替层叠电极和层叠陶瓷电容器的电介质,以便在高温下同时烧结它们。解决方案:钴涂覆的铜细粉在通过歧化反应形成的铜细粉的表面上具有钴层。在制备钴包覆的铜细粉的方法中,通过氧化亚铜的歧化反应形成铜细粉,通过化学置换镀覆将铜(Pd)镀在铜细粉上,并且通过化学镀将钴涂覆在其上。 。;版权:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013181177A

    专利类型

  • 公开/公告日2013-09-12

    原文格式PDF

  • 申请/专利权人 JX NIPPON MINING & METALS CORP;

    申请/专利号JP20120043508

  • 发明设计人 KUROSAWA TOSHIO;

    申请日2012-02-29

  • 分类号B22F1/02;B22F1/00;B22F9/00;H01B5/00;H01B13/00;H01B1/00;H01B1/22;C23C18/34;C23C18/52;

  • 国家 JP

  • 入库时间 2022-08-21 17:03:16

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