PRETREATMENT METHOD FOR ELECTROPLATING, AND METHOD OF PRODUCING COPPER CLAD LAMINATED RESIN FILM BY ELECTROPLATING METHOD INCLUDING THE PRETREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of depositing an electroplated film reduced in fine surface defect on a long-length conductive substrate conveyed roll to roll.;SOLUTION: A pretreatment method performed before continuously performing electroplating on a long-length film F with a thin film as a long-length conductive substrate conveyed by a roll to roll system by immersing it in an electroplating bath 21 includes the process of immersing the long-length film F with the thin film in a cleaning bath filled with a chemical liquid 53 such as, for example, sulfuric acid or the like as a cleaning solution and the process of nipping the long-length film F with the thin film by one pair of ringer rolls 55 of 70-90° in surface hardness directly after immersing it in the cleaning bath.;COPYRIGHT: (C)2013,JPO&INPIT