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CERAMIC SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC SUBSTRATE
CERAMIC SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC SUBSTRATE
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机译:陶瓷基体,电子设备和电子设备,电子设备的制造方法和陶瓷基体的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a ceramic substrate in which cracking of the end face and occurrence of chipping can be prevented, and to provide an electronic device, an electronic apparatus, a manufacturing method of an electronic device, and a manufacturing method of a ceramic substrate.SOLUTION: The ceramic substrate includes a base material 1 composed of ceramic, and grooves 11, 21 formed in one surface side of the base material 1. The grooves 11, 21 have a strip shape in the plan view. The distance between the first bottom face 13a out of the bottom faces 13 of the grooves 11, 21 and the one surface is larger than the distance between a second bottom face 13b out of the bottom face 13 of the grooves 11, 21, at a position different from that of the first bottom face 13a, and the one surface. The grooves 11, 21 have a strip shape in the plan view, and a planar or a gently curved side face 12. The side face 12 becomes the end face of the ceramic substrate 10 after it is divided.
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