首页> 外国专利> CERAMIC SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC SUBSTRATE

CERAMIC SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD OF CERAMIC SUBSTRATE

机译:陶瓷基体,电子设备和电子设备,电子设备的制造方法和陶瓷基体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate in which cracking of the end face and occurrence of chipping can be prevented, and to provide an electronic device, an electronic apparatus, a manufacturing method of an electronic device, and a manufacturing method of a ceramic substrate.SOLUTION: The ceramic substrate includes a base material 1 composed of ceramic, and grooves 11, 21 formed in one surface side of the base material 1. The grooves 11, 21 have a strip shape in the plan view. The distance between the first bottom face 13a out of the bottom faces 13 of the grooves 11, 21 and the one surface is larger than the distance between a second bottom face 13b out of the bottom face 13 of the grooves 11, 21, at a position different from that of the first bottom face 13a, and the one surface. The grooves 11, 21 have a strip shape in the plan view, and a planar or a gently curved side face 12. The side face 12 becomes the end face of the ceramic substrate 10 after it is divided.
机译:解决的问题:提供一种陶瓷基板,其中可以防止端面破裂和碎裂的发生,并且提供一种电子设备,电子设备,电子设备的制造方法和制造方法。陶瓷基板。解决方案:陶瓷基板包括:由陶瓷构成的基材1;以及在基材1的一个表面侧形成的凹槽11、21。在平面图中,凹槽11、21具有条形形状。凹槽11、21的底面13中的第一底面13a与一个表面之间的距离大于凹槽11、21的底面13中的第二底面13b与第二表面13b之间的距离。与第一底面13a和一个表面不同的位置。槽11、21在平面图中具有条形形状,并且具有平坦的或平缓弯曲的侧面12。侧面12在分割后成为陶瓷基板10的端面。

著录项

  • 公开/公告号JP2013125855A

    专利类型

  • 公开/公告日2013-06-24

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20110273631

  • 发明设计人 YOSHIIKE MASASHI;

    申请日2011-12-14

  • 分类号H05K1/02;H05K3;B23K26;C04B41/91;

  • 国家 JP

  • 入库时间 2022-08-21 17:02:45

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