LAMINATION STRUCTURE HAVING INDIUM SILVER-COBALT ALLOY LAYER ON COPPER OR COPPER ALLOY LAYER, AND METHOD OF MANUFACTURING THE LAMINATION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a laminated structure that has a thin plating thickness, is difficult to peel off, excels in wire bonding and sulphur resistance, without decrease in the reflectance, can achieve long lifetime, reduce cost and improve quality.;SOLUTION: There is provided a lamination structure that has an indium-silver-cobalt alloy layer that contains indium of ≥40 mass% and ≤90 mass%, silver of ≥10 mass% and ≤60 mass%, and the cobalt of ≥0.01 mass% and ≤5 mass% on copper or copper alloy, and in addition has the oxide layer on the indium-silver-cobalt alloy layer, wherein the copper is diffused in the indium-silver-cobalt alloy layer.;COPYRIGHT: (C)2013,JPO&INPIT