LAMINATION STRUCTURE HAVING INDIUM-SILVER ALLOY LAYER ON COPPER OR COPPER ALLOY LAYER, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a lamination structure that has a thin plating thickness, is hardly peeled off, is excellent in wire bondability and sulfuration resistance, does not deteriorate reflectance, and enables long life, cost reduction and quality improvement.;SOLUTION: The lamination structure includes: an indium-silver alloy layer containing indium of 40 mass% or more and 90 mass% or less on copper or copper alloy; and, on the indium-silver alloy layer, the oxide layer thereof. In the lamination structure, copper is diffused on the indium-silver alloy layer.;COPYRIGHT: (C)2013,JPO&INPIT