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HIGH DENSITY ELECTRICAL INTERCONNECT USING LIMITED DENSITY FLEX CIRCUITS
HIGH DENSITY ELECTRICAL INTERCONNECT USING LIMITED DENSITY FLEX CIRCUITS
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机译:使用有限密度挠性电路的高密度电气互连
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摘要
PROBLEM TO BE SOLVED: To provide a method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array.;SOLUTION: A first pad array is included on a first flex circuit to power a first portion of the array of the piezoelectric element 30 of the print head, and a second pad array is included on a second flex circuit to power a second portion of the array of the piezoelectric element 30 of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.;COPYRIGHT: (C)2013,JPO&INPIT
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