首页> 外国专利> LEAD FRAME WITH REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME SUBSTRATE FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LEAD FRAME WITH REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF OPTICAL SEMICONDUCTOR DEVICE

LEAD FRAME WITH REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME SUBSTRATE FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LEAD FRAME WITH REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF OPTICAL SEMICONDUCTOR DEVICE

机译:用于光学半导体器件的带反射元件的铅框架,用于光学半导体器件的带铅框架,用于光学半导体设备的铅框架,光学半导体器件,用于制造带电导体的方法,用于制造带引线框架的方法,用于制造半导体器件的方法

摘要

PROBLEM TO BE SOLVED: To provide a lead frame with a reflecting member for an optical semiconductor device, a lead frame for an optical semiconductor device, a lead frame substrate for an optical semiconductor device, an optical semiconductor device, a manufacturing method of a lead frame with a reflecting member for an optical semiconductor device, and a manufacturing method of an optical semiconductor device, having high reflectance and excellent in heat dissipation while securing insulation property between a reflector and a lead part (electrode part) of a lead frame even when a metal reflector and a metal lead frame are used.;SOLUTION: A lead part (electrode part) of a metal lead frame is made to be a step structure, insulation property with a metal reflector is secured by filling an insulating resin in the step, and a die pad part (element mounting part) of the metal lead frame and the metal reflector are bonded via a bonding layer having heat conductivity.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种具有用于光半导体器件的反射构件的引线框架,用于光半导体器件的引线框架,用于光半导体器件的引线框架基板,光半导体器件,引线的制造方法具有用于光半导体器件的反射构件的框架以及一种光半导体器件的制造方法,即使在反射器与引线框架的引线部分(电极部分)之间保持绝缘性的同时,也具有高反射率和优异的散热性。解决方案:将金属引线框的引线部分(电极部分)制成阶梯结构,通过在阶梯中填充绝缘树脂来确保与金属反射器的绝缘性,并通过具有导热性的接合层将金属引线框架的管芯焊盘部分(元件安装部分)与金属反射器接合。COPYRIGHT:(C)2013,JPO& INPIT

著录项

  • 公开/公告号JP2013069972A

    专利类型

  • 公开/公告日2013-04-18

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20110208742

  • 发明设计人 NARUMI ATSUSHI;

    申请日2011-09-26

  • 分类号H01L33/62;

  • 国家 JP

  • 入库时间 2022-08-21 17:00:12

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