Manufacturing method for the surface modification method and metal-clad laminate of polyimide resin layer

摘要

While collateral sufficient adhesive strength to meet even the fine pitch of the printed circuit board, relates to a method for producing a metal-clad laminate and the surface treatment method of the polyimide resin layer that can cope with very thinning of the insulating resin layer. A step of modifying treatment with an alkaline aqueous solution the surface of the polyimide resin layer, the surface treatment method of the polyimide resin layer, the polar containing amino compound aromatic amino compounds, diamino siloxane such as modifying treatment surface of the polyimide resin layer and a step of forming a processing layer of the amino compound by coating and drying a solution. In addition, I include a step of imidization process the treated layer of the amino compound of the polyimide resin layer. In addition, to obtain a metal-clad laminate by depositing a metal or heat bonding metal foil to the polyimide resin layer is surface treated. In addition, to obtain a polyimide resin laminate by thermocompression bonding a polyimide resin layer surface treated two.