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Manufacturing method for the surface modification method and metal-clad laminate of polyimide resin layer
Manufacturing method for the surface modification method and metal-clad laminate of polyimide resin layer
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机译:聚酰亚胺树脂层的表面改性方法的制造方法及覆金属层压板
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摘要
The invention relates to a surface treatment process for enhancing the adhesiveness of polyimide resin layers dramatically by simple surface treatment. This process brings about enhancement in the adhesiveness of polyimide resin layers even to a low-roughness copper foil suitable for fine-pitch pattern formation and can give metal-clad laminates useful as substrates for high-density printed wiring boards and HDD suspension. The process comprises the step (a) of treating the face of a polyimide resin layer with plasma to form a plasma-treated surface and the step (b) of applying a solution of an amino compound in a polar solvent on the plasma-treated surface and drying and heat-treating the resulting coating to form a surface modification layer. A polyimide resin layer obtained by the process which bears a modification layer on the face can advantageously give metal-clad laminates useful as wiring substrates by forming a metal layer on the surface of the modification layer by means of thermocompression bonding or vapor deposition.
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