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Adhesive sheet for semiconductor wafer back grinding and semiconductor wafer back grinding method using this back grinding adhesive sheet
Adhesive sheet for semiconductor wafer back grinding and semiconductor wafer back grinding method using this back grinding adhesive sheet
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机译:半导体晶片背面研磨用粘合片及使用该背面研磨粘合片的半导体晶片背面研磨方法
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摘要
The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 µm. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer.
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