首页> 外国专利> METHOD FOR STICKING DIAMOND USING DISPLACEMENT PLATING AND DEVICE FOR STICKING DIAMOND USED FOR THE SAME

METHOD FOR STICKING DIAMOND USING DISPLACEMENT PLATING AND DEVICE FOR STICKING DIAMOND USED FOR THE SAME

机译:用位移盘刻钻石的方法和用于该方法的钻石刻花装置

摘要

PROBLEM TO BE SOLVED: To provide a method for sticking diamond using displacement plating, and to provide a device used for the method.;SOLUTION: The method for sticking diamond is characterized by immersing a base material 301 to be plated, into a displacement plating liquid 320 which contains a plating substance having an ionization tendency lower than that of the base material 301 in an ionized state and in which diamond particles 322 is dispersed, so that the diamond particles 322 may be stuck together with the plating substance to the base material 301 while the plating substance is displacement-plated on the base material 301.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种利用置换镀覆法附着金刚石的方法,并提供一种用于该方法的装置。解决方案:该附着钻石的方法的特征在于将待镀覆的基材301浸入置换覆膜中。液体320含有离子化状态下的离子化趋势低于基材301的电镀物质,并且其中分散有金刚石颗粒322,使得金刚石颗粒322可以与电镀物质一起粘附到基材上301,同时将电镀物质置换电镀在基材301上;;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013044051A

    专利类型

  • 公开/公告日2013-03-04

    原文格式PDF

  • 申请/专利权人 EHWA DIAMOND INDUSTRIAL CO LTD;

    申请/专利号JP20120031339

  • 发明设计人 SUNG RAK JOO;PARK SANG WOOK;

    申请日2012-02-16

  • 分类号C23C18/31;

  • 国家 JP

  • 入库时间 2022-08-21 16:58:12

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