Being the chemical polishing medicine which is used for the metal plated mannered null copper or the plating preprocessing of the copper alloy surface which uses the copper

摘要

PROBLEM TO BE SOLVED: To provide a chemical polishing agent of copper or copper alloy which forms a surface state of a required and sufficient level, without generation of unevenness or the like, as pretreatment of plating of the copper or the copper alloy to which metal plating is applied, and to provide a metal plating method using the copper or the copper alloy treated before plating using the chemical polishing agent, as a plated material.;SOLUTION: The chemical polishing agent to be used for pretreatment of plating of a surface of the copper or the copper alloy includes each component of ferric sulfate, sulfuric acid, a nonionic surface active agent, and a halogen ion, wherein a value of a ratio of contents of the sulfuric acid to contents of the ferric sulfate, [the contents of the sulfuric acid]/[the contents of the ferric sulfate] is 1 to 4.;COPYRIGHT: (C)2009,JPO&INPIT