A method of forming a micromechanical resonator having a high density array of trenches to provide a passive temperature compensation

摘要

A method of forming a micromechanical resonator type includes forming a (12) resonator body to be locked to the substrate (10) (12a, 12b) by an anchor at least the first. The resonator body may comprise a first material of the semiconductor or other elastic material having a negative temperature coefficient (TCE). Two-dimensional array of trenches spaced (14) is provided in the resonator body. These trenches may be filled second material with the other (16a) or an electrically insulating material having a TCE positive. The array of trenches includes the body in the area where there is less mechanical stress and a relatively large while it can extend uniformly over the entire body of the resonator, to resonate. Two-dimensional array of the trench (ie, network) the mass has a spring in series and / or parallel to the moving direction of the acoustic wave resonator body during the resonance - be modeled as a network of the spring system I could. [Selection Figure] Figure 1A