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Vertical power transistor devices, semiconductor chips, and method of manufacturing a vertical power transistor devices

机译:垂直功率晶体管器件,半导体芯片以及制造垂直功率晶体管器件的方法

摘要

A vertical power transistor device comprises: a substrate formed from a III-V semiconductor material and a multi-layer stack at least partially accommodated in the substrate. The multi-layer stack comprises: a semi-insulating layer disposed adjacent the substrate and a first layer formed from a first III-V semiconductor material and disposed adjacent the semi-insulating layer. The multi-layer stack also comprises a second layer formed from a second III-V semiconductor material disposed adjacent the first layer and a heterojunction is formed at an interface of the first and second layers.
机译:一种垂直功率晶体管器件,包括:由III-V族半导体材料形成的衬底;以及至少部分容纳在该衬底中的多层堆叠。所述多层堆叠包括:半绝缘层,其邻近所述基板设置;以及第一层,其由第一III-V族半导体材料形成并且邻近所述半绝缘层设置。多层堆叠还包括由第二III-V族半导体材料形成的第二层,该第二III-V族半导体材料邻近第一层设置,并且异质结形成在第一层和第二层的界面处。

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