首页>
外国专利>
Being manner in order the alignment to do the aforementioned wafer substrate manner in order the alignment to do the wafer
Being manner in order the alignment to do the aforementioned wafer substrate manner in order the alignment to do the wafer
展开▼
机译:以对准方式做上述晶片基板以对准方式做晶片
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide an alignment system enabling measurement and modeling of an asymmetrical target, special design and/or delicate adjustment of a target geometry (geometric structure) in order to correct drawbacks of the conventional method.;SOLUTION: By forming one or more sub-targets on an alignment target, the alignment target is made to have a geometry design. An alignment system aligns one or all the plurality of sub-targets. An algorithm is used for characterizing process and calculating alignment of the alignment system.;COPYRIGHT: (C)2008,JPO&INPIT
展开▼