Production manner of the carrier for the both sides grinding device, in the carrier for the both sides grinding device and the both sides grinding device which

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a carrier for double-side polishing device capable of accurately processing a resin insert to have a desired inner circumferential shape by suppressing its distortion, and capable of suppressing peripheral sagging and nanotopological failures of a polished wafer.;SOLUTION: The method for manufacturing the carrier for the double-side polishing device includes: a carrier body arranged between upper and lower surface plates to which polishing cloths are respectively attached, and provided with a holding hole for holding a wafer inserted between the upper and lower surface plates when polishing; and a ring-like resin insert disposed along the inner circumference of the holding hole of the carrier body, and having an inner circumferential surface coming in contact with the circumferential part of the wafer to be held. In the method, at least the base material of the resin insert having no inner circumferential surface coming in contact with the wafer to be held is mounted in the holding hole of the carrier body, then the process of forming the inner circumferential surface is performed on the base material of the resin insert to form the inner circumferential surface coming in contact with the circumferential part of the wafer to be held.;COPYRIGHT: (C)2011,JPO&INPIT