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Sn component replenishment stannous oxide powder into Sn alloy plating solution

机译:将锡成分补充到氧化锡粉末中的锡合金电镀液

摘要

PROBLEM TO BE SOLVED: To provide stannous oxide powder for supplying an Sn component into an Sn alloy plating liquid which achieves the supply of an Sn component into a plating liquid by direct addition, and whose solubility to an acid or acidic plating liquid is extremely high.;SOLUTION: The stannous oxide powder is characterized in that, when 20g of stannous oxide powder is added to 300 mL of an alkane sulfonic acid aqueous solution heated at 23 to 28°C, and stirring is performed, it has a dissolution rate of being dissolved within 5 s. It is preferable that the average particle diameter of the stannous oxide powder lies in the range of 10 to 20 μm by D50 value, and also, its tap density is 0.6 to 1.2 g/cm3.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种用于将Sn成分供给到Sn合金镀液中的氧化亚锡粉末,其通过直接添加而将Sn成分供给到镀液中,并且其对酸或酸性镀液的溶解性极高。解决方案:氧化亚锡粉末的特征在于,将20g氧化亚锡粉末添加到300 mL加热至23至28℃的烷烃磺酸水溶液中并进行搅拌时,其溶解速率为在5秒钟内溶解。按D50值计,氧化亚锡粉末的平均粒径优选在10至20μm的范围内,并且其振实密度为0.6至1.2g / cm 3 。 ;版权:(C)2009,日本特许厅&INPIT

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