Being yield rate improvement manner of yield rate

摘要

PROBLEM TO BE SOLVED: To provide a method of improving the yield of solder bumps.;SOLUTION: In one embodiment of this method of improving the yield of solder bumps, a bump 114 (that is, a solder bridge) is divided by laser cutting by a laser head 150. In another embodiment, reflow is executed to a solder bump skip printing position by a laser.;COPYRIGHT: (C)2010,JPO&INPIT