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Semiconductor shape evaluation system using the same pattern shape evaluation method, pattern shape evaluation apparatus, and pattern shape evaluation data generation equipment

机译:使用相同的图案形状评估方法的半导体形状评估系统,图案形状评估装置和图案形状评估数据生成设备

摘要

PROBLEM TO BE SOLVED: To provide a means for detecting the failure of a circuit pattern accurately with high speed by comparing the pattern, formed on a photo mask or a wafer, with design data.;SOLUTION: The evaluating method, provided with a means for extracting the profile data 0107 of a pattern out of an image which photographed a semiconductor pattern, a means for producing data related to the direction of a pattern out of the design data 0102 of the semiconductor and a means for detecting the failure of the pattern by obtaining the data of direction of the pattern out of the profile data to compare with the data related to the direction of the pattern produced out of the design data corresponding to the pattern position of the profile data, and an inspection system are built up.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种通过将形成在光掩模或晶片上的图案与设计数据进行比较来高速,准确地检测出电路图案的故障的手段。解决方案:具有一种手段的评估方法用于从拍摄半导体图案的图像中提取图案的轮廓数据0107,从半导体的设计数据0102中生成与图案的方向有关的数据的装置以及用于检测图案的故障的装置通过从轮廓数据中获得图案方向的数据,并与从与轮廓数据的图案位置相对应的设计数据中产生的图案的方向相关的数据进行比较,来建立检查系统。 ;版权:(C)2009,日本特许厅&INPIT

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