Pretreatment agent for electroless plating, electroless plating products and electroless plating method using it

摘要

The present invention is capable of forming non-pretreatment agent for electroless plating that can be stably maintained for a long period of Pd (II) in an organic solvent, the electroless plated film having excellent adhesion of using it is for the object of the present invention to provide an electroless plating material and the electrolytic plating method, a metal-binding ability which is selected from the group consisting of an organic palladium compound, imidazole analogs, polyethylene amine, ethylene imine, polyethylene imine, such problems It is to solve the pretreatment agent for electroless plating, which is characterized in that it consists in dissolving in an organic solvent and a coordinating compound having a functional group having a.