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The silicon anisotropic etching medicine composition null 4th class

机译:硅各向异性蚀刻药物组合物第四类

摘要

PROBLEM TO BE SOLVED: To provide an etching agent composition in which silicon etching speed is high, and silicon etching process time is shortened while keeping etching property such as etching speed ratio by crystal surface, a smoothness of etching surface, an etching agent composite which can selectively process only silicon in anisotropic etching without etching aluminum or aluminum alloy often used for electrode or wiring material, and an etching method of silicon and electronic apparatus with the silicon substrate processed in its etching which use this etching agent composition.;SOLUTION: A silicon anisotropic etching agent composition characteristically contains alkali compound, reducing compound, and anticorrosive.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种蚀刻剂组合物,其中硅蚀刻速度高,并且缩短了硅蚀刻处理时间,同时保持了诸如通过晶体表面的蚀刻速度比,蚀刻表面的光滑度等蚀刻性能。可以选择性地仅进行各向异性蚀刻中的硅而无需蚀刻经常用于电极或布线材料的铝或铝合金,以及一种硅和电子设备的蚀刻方法,该硅和电子设备具有使用该蚀刻剂组合物进行蚀刻的硅基板。硅各向异性蚀刻剂组合物的特征是含有碱金属化合物,还原性化合物和防腐剂。;版权所有:(C)2007,日本特许会计师事务所

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