Copper surface treatment solution set, a surface treatment method for copper using the same, copper, a wiring board and a semiconductor package

摘要

PROBLEM TO BE SOLVED: To provide a copper surface treatment liquid set with which fine ruggedness with the Rz of ≤1 μm can be densely and uniformly formed on the surface of copper in a short time, to provide a surface treatment method for copper using the treatment liquid set, to provide copper surface-treated applying the surface treatment method, to provide a wiring board having copper wiring surface-treated applying the surface treatment method, and to provide a semiconductor package obtained by using the board.;SOLUTION: The copper surface treatment liquid set is provided with: an acidic noble metal treatment liquid comprising the salt of a metal nobler than copper and discretely forming a metal nobler than copper on the surface of copper; and an alkaline oxidation treatment liquid comprising a phosphate and an oxidizer and oxidizing the surface of copper. Upon its use, a metal nobler than copper is discretely formed on the surface of copper using the noble metal treatment liquid, and thereafter, the copper surface is subjected to oxidation treatment using the oxidation treatment liquid, thus fine ruggedness by the dense and uniform crystals of copper oxide can be formed on the copper surface.;COPYRIGHT: (C)2008,JPO&INPIT