The conservation film formation formation which was formed on the burble aspect of the sheet

摘要

PROBLEM TO BE SOLVED: To provide a sheet for forming a protective film for a chip, with which a highly reliable semiconductor device can be manufactured even when exposed under severe heat and humidity conditions, in the semiconductor device on which a semiconductor chip with the protective film formed on a reverse surface is mounted.;SOLUTION: The sheet for forming the protective film for the chip has a release sheet and a protective film forming layer formed on the release surface of the release sheet, the protective film forming layer comprising a protective film forming composition containing an acrylic copolymer (A) having a structural unit originating from (meth)acryloyl morpholine, an epoxy-based thermosetting resin (B), and a thermal curing agent (C).;COPYRIGHT: (C)2010,JPO&INPIT