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Foreign body polishing apparatus and polishing method of foreign body work surface

机译:异物抛光设备和异物工作表面的抛光方法

摘要

Create a data for correction can catch defects of the workpiece surface, and to measure the height of the foreign matter must be corrected based on this information, the height was measured, polishing normal when the first reference below the process proceeds to step, the process proceeds to the temporary polishing process when the second reference is less than the first reference above, it is determined that it is not polished at the time of the second reference above. This temporary polishing step, a predetermined amount only by lowering the polishing head, and with feeding the polishing tape from the supply reel, while wound by the winding reel, is pressed against a polishing head for polishing tape between the take-up reel and supply reel The move to polishing normal when examined by grinding the foreign substance, that whether the change occurs in the height of the foreign matter, change occurs in the height, and not polished when there is no change in height. By this, so even when the foreign matter of high hardness and large size are adhered to the work surface and to prevent scuffing drag and breakage of the abrasive tape and, without reducing as much as possible throughput.
机译:创建校正数据可以捕捉到工件表面的缺陷,并根据该信息来测量异物的高度,必须对该高度进行校正,然后测量高度,当法线下的第一个参考前进到步骤时,抛光正常当第二参考值小于上述第一参考值时,处理进入临时抛光过程,则确定在上述第二参考值时未对其进行抛光。该临时抛光步骤仅通过降低抛光头就可以达到预定的量,并在从供带盘送入抛光带的同时,将其缠绕在卷带盘上,然后将其压紧在供带盘和供带盘之间的用于抛光带的抛光头上。卷轴通过打磨异物检查是否达到打磨正常状态,即异物的高度是否发生变化,高度是否发生变化,而高度没有变化则不进行抛光。这样,即使当高硬度和大尺寸的异物附着在工作表面上时,也可以防止刮擦阻力和砂带的断裂,并且不会降低生产率。

著录项

  • 公开/公告号JPWO2011061884A1

    专利类型

  • 公开/公告日2013-04-04

    原文格式PDF

  • 申请/专利权人 シャープ株式会社;

    申请/专利号JP20110541790

  • 发明设计人 佐藤 仁;藤井 茂喜;

    申请日2010-09-01

  • 分类号B24B21/00;B24B27/033;

  • 国家 JP

  • 入库时间 2022-08-21 16:53:12

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