首页> 外国专利> Semiconductor Device Having A Modified Shallow Trench Isolation (STI) Region And A Modified Well Region

Semiconductor Device Having A Modified Shallow Trench Isolation (STI) Region And A Modified Well Region

机译:具有修改的浅沟槽隔离(STI)区和修改的阱区的半导体器件

摘要

An apparatus is disclosed to increase a breakdown voltage of a semiconductor device. The semiconductor device can include a modified breakdown shallow trench isolation (STI) region to effectively reduce its drain to source resistance when compared to a conventional semiconductor device. This reduction in the drain to source resistance increases the breakdown voltage of the semiconductor device when compared to the conventional semiconductor device by allowing more current to pass from a source region to a drain region of the semiconductor device. The semiconductor device can include a modified well region to reduce its drain to source resistance. The modified well region allows more current to pass from a source region to a drain region of the semiconductor device, thereby further increasing the break down voltage of the semiconductor device from that of the conventional semiconductor device.
机译:公开了一种用于增加半导体器件的击穿电压的装置。与常规半导体器件相比,该半导体器件可以包括改进的击穿浅沟槽隔离(STI)区域,以有效地减小其漏极至源极的电阻。与常规的半导体器件相比,通过使更多的电流从半导体器件的源极区流向漏极区,漏极至源极电阻的这种减小增加了半导体器件的击穿电压。半导体器件可以包括修改的阱区以减小其漏极至源极的电阻。修改的阱区允许更多的电流从半导体器件的源极区流到漏极区,从而与常规半导体器件相比,进一步增加了半导体器件的击穿电压。

著录项

  • 公开/公告号US2012313166A1

    专利类型

  • 公开/公告日2012-12-13

    原文格式PDF

  • 申请/专利权人 AKIRA ITO;

    申请/专利号US201213567524

  • 发明设计人 AKIRA ITO;

    申请日2012-08-06

  • 分类号H01L29/78;

  • 国家 US

  • 入库时间 2022-08-21 16:52:38

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