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Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method

机译:通过刷镀电化学涂覆基材的方法和实施该方法的装置

摘要

A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.
机译:用于基板的电化学涂覆的方法使用刷镀。这是通过电解质进行的,其中分散了颗粒,这些颗粒被嵌入显影层中。建议通过单独的导管系统将颗粒添加到电解质的载体中。电解质通过导管系统添加。以这种方式实现了,因为在进料颗粒和形成层之间仅经过了很短的时间,所以可以防止电解质中的颗粒附聚。用于电化学涂层的装置具有为此目的而提供的两个导管系统。

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