A co-axial microwave bolometer architecture is disclosed that uses thick-film processes to construct very small thermistors on a substrate that is selected for low heat transfer. Thermal isolation is further enhanced by making the planar electrodes from a metal with lower heat transfer than typical electrical metals. Furthermore, a resistor with very strong temperature coefficient (thermistor), is arranged such that connecting metal paths are arranged axially, and as generally flat, thin, planar conductors. Additionally, the substrate of the thermistor is selected to have very low conductivity of heat, so the thermistor element itself is well isolated thermally from its surroundings.
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