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3D integrated circuit stack-wide synchronization circuit
3D integrated circuit stack-wide synchronization circuit
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机译:3D集成电路全栈同步电路
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摘要
There is provided a synchronization circuit for a 3D chip stack having multiple circuits and multiple strata interconnected using a first and a second stack-wide broadcast connection chain. The synchronization circuit includes the following, on each stratum. A synchronizer connected to the first connection chain receives an asynchronous signal therefrom and performs a synchronization to provide a synchronous signal. A driver is connected to the second chain for driving the synchronous signal. A latch connected to the second chain receives the synchronous signal driven by the driver on a same or different stratum within a next clock cycle from the synchronization to provide the stack-wide synchronous signal to a circuit on a same stratum. An output of a single driver on one stratum is selected at any given time for use by the latch on all strata.
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