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Low-defect density gallium nitride semiconductor structures and fabrication methods

机译:低缺陷密度氮化镓半导体结构与制造方法

摘要

A low-defect gallium nitride structure including a first gallium nitride layer comprising a plurality of gallium nitride columns etched into the first gallium nitride layer and a first dislocation density; and a second gallium nitride layer that extends over the gallium nitride columns and comprises a second dislocation density, wherein the second dislocation density may be lower than the first dislocation density. In addition, a method for fabricating a gallium nitride semiconductor layer that includes masking an underlying gallium nitride layer with a mask that comprises an array of columns and growing the underlying gallium nitride layer through the columns and onto said mask using metal-organic chemical vapor deposition pendeo-epitaxy to thereby form a pendeo-epitaxial gallium nitride layer coalesced on said mask to form a continuous pendeo-epitaxial monocrystalline gallium nitride semiconductor layer.
机译:一种低缺陷氮化镓结构,包括第一氮化镓层和第一位错密度,所述第一氮化镓层包括被蚀刻到所述第一氮化镓层中的多个氮化镓柱。第二氮化镓层在氮化镓柱上延伸并包括第二位错密度,其中第二位错密度可以低于第一位错密度。另外,一种用于制造氮化镓半导体层的方法,该方法包括:利用包括列的阵列的掩模来掩蔽下面的氮化镓层,并使用金属有机化学气相沉积法将下面的氮化镓层穿过所述列并生长到所述掩模上。进行外延外延,从而形成在所述掩模上聚结的外延外延氮化镓层,以形成连续的外延外延单晶氮化镓半导体层。

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