Packaging design supporting device and packaging design supporting method for semiconductor integrated circuit and recording medium

摘要

A disclosed packaging design supporting device for a semiconductor integrated circuit includes a selection data acquisition unit inputting a change of the selected logic cell; a bulk fix data generation unit generating bulk fix data in which a bulk layer of the semiconductor substrate of the semiconductor integrated circuit has been fixed, arranging a design-change dummy logic cell in a region where no logic cell is arranged in the bulk layer, and generating a design-change logic cell by wiring the design-change dummy logic cell; and a selection cell move determination unit prohibiting the change with respect to the selected logic cell.