In a method for integrating at least one electronic component (31) in a printed circuit board or a printed circuit board intermediate product (37), the following steps are provided: - Providing a layer (32) for at least temporary support of the electronic component (31), - Setting the electronic Component (31) on the layer (32), - arranging a conductive layer (35) on the supporting layer (32) with at least one release (38) corresponding to the dimensions of the electronic component to be determined (31), - at least partially sheathing or Covering the component (31) fixed on the supporting layer (32) with an insulating material (36), exposing the electronic component (31), and at least portions of the component (31) adjoining the supporting layer (32 ), and - at least partially contacting the electronic component (31) with the component adjacent to the le In addition, a printed circuit board (37) or a printed circuit board intermediate product with an integrated electronic component (31) is provided.
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