首页> 外国专利> METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A CONDUCTOR PLATE OR A PCB INTERMEDIATE PRODUCT AND PCB OR INTERMEDIATE CIRCUIT PRODUCT

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A CONDUCTOR PLATE OR A PCB INTERMEDIATE PRODUCT AND PCB OR INTERMEDIATE CIRCUIT PRODUCT

机译:将电子组件集成到导体板或PCB中间产品以及PCB或中间电路产品中的方法

摘要

In a method for integrating at least one electronic component (31) in a printed circuit board or a printed circuit board intermediate product (37), the following steps are provided: - Providing a layer (32) for at least temporary support of the electronic component (31), - Setting the electronic Component (31) on the layer (32), - arranging a conductive layer (35) on the supporting layer (32) with at least one release (38) corresponding to the dimensions of the electronic component to be determined (31), - at least partially sheathing or Covering the component (31) fixed on the supporting layer (32) with an insulating material (36), exposing the electronic component (31), and at least portions of the component (31) adjoining the supporting layer (32 ), and - at least partially contacting the electronic component (31) with the component adjacent to the le In addition, a printed circuit board (37) or a printed circuit board intermediate product with an integrated electronic component (31) is provided.
机译:在用于将至少一个电子部件(31)集成在印刷电路板或印刷电路板中间产品(37)中的方法中,提供以下步骤:-提供用于至少临时支撑电子设备的层(32)。部件(31),-将电子部件(31)放置在层(32)上,-在支撑层(32)上布置导电层(35),并具有至少一个与电子部件的尺寸相对应的脱模剂(38)待确定的部件(31),-用绝缘材料(36)至少部分覆盖或覆盖固定在支撑层(32)上的部件(31),露出电子部件(31),以及至少一部分部件(31)邻接支撑层(32),并且-使电子部件(31)至少部分地与邻近于电子元件的部件接触。此外,印刷电路板(37)或印刷电路板中间产品具有集成电子元件(31 )。

著录项

  • 公开/公告号AT13055U1

    专利类型

  • 公开/公告日2013-05-15

    原文格式PDF

  • 申请/专利号AT20110000041U

  • 发明设计人

    申请日2011-01-26

  • 分类号H05K1/18;

  • 国家 AT

  • 入库时间 2022-08-21 16:39:02

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