CIRCUIT SUBSTRATE FOR LARGE-CAPACITY MODULE PERIPHERY CIRCUIT, AND LARGE-CAPACITY MODULE INCLUDING PERIPHERY CIRCUIT EMPLOYING CIRCUIT SUBSTRATE

摘要

[Problem] An objective of the present invention is to provide a circuit substrate for a periphery circuit in a large-capacity module such as an inverter or other power module, in which it is possible, while achieving miniaturization, lighter weight, lower surges and minimal loss, to more efficiently transmit heat externally from a power semiconductor element or other high heat element. [Solution] In a large-capacity module, by layering a periphery circuit upon a high heat element, said periphery circuit using a ceramic substrate wherein an electrode configured of a thick conductor is embedded, overheating of the module is avoided by effective radiation via the substrate while achieving miniaturization, lighter weight, lower surges, and minimal loss of the module.