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METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM FOR BREAKING BRITTLE MATERIAL BOARD
METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM FOR BREAKING BRITTLE MATERIAL BOARD
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机译:划伤脆性材料板的方法和装置以及脆性材料板的断裂系统
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摘要
During scribing processes of a brittle material substrate, the present invention prevents the generation of an unnecessary crack deriving in an unspecified and uncontrollable direction. The mother glass substrate is suction-chucked onto the first securing table and the second securing table via suction by a vacuum pump and that alike from suction holes set up on the surfaces of the first securing table and the second securing table. Unequal internal stresses existing at this time within the inner section of the mother glass substrate become erased once, by means of moving the first securing table and/or the second securing table for a micro distance along a predetermined direction. After adjusting the stresses towards a specific direction, scribing is to be conduct.
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