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METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM FOR BREAKING BRITTLE MATERIAL BOARD

机译:划伤脆性材料板的方法和装置以及脆性材料板的断裂系统

摘要

During scribing processes of a brittle material substrate, the present invention prevents the generation of an unnecessary crack deriving in an unspecified and uncontrollable direction. The mother glass substrate is suction-chucked onto the first securing table and the second securing table via suction by a vacuum pump and that alike from suction holes set up on the surfaces of the first securing table and the second securing table. Unequal internal stresses existing at this time within the inner section of the mother glass substrate become erased once, by means of moving the first securing table and/or the second securing table for a micro distance along a predetermined direction. After adjusting the stresses towards a specific direction, scribing is to be conduct.
机译:在脆性材料基板的划线过程中,本发明防止了在未指定和不可控制的方向上产生不必要的裂纹。所述玻璃母基板通过真空泵的抽吸和从设置在所述第一固定台和所述第二固定台的表面上的抽吸孔的抽吸被吸到所述第一固定台和所述第二固定台上。通过沿着预定方向将第一固定台和/或第二固定台移动微小距离,一次消除了此时存在于母玻璃基板的内部内部的不相等的内部应力。在朝特定方向调整应力后,应进行划线。

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