BONDING DEVICE AND BONDING POSITION ADJUSTMENT METHOD USING SAID BONDING DEVICE

摘要

Provided is a bonding device that is capable of obtaining a high-quality bonded body in which a first member and a second member are bonded together, with no position drift between the first member and the second member in the bonded body. Said bonding device comprises: a bottom chuck (11) that places and holds a wafer (W1) on the top surface thereof; a top chuck (12) that is placed opposite the top of said bottom chuck (11) and holds a wafer (W2); and a position adjustment mechanism (20) that adjusts the bonding position between the wafer (W1) held by the bottom chuck (11) and the wafer (W2) held by the top chuck (12). The position adjustment mechanism (20): moves the top chuck (12) horizontally by means of four position-adjusting cam members (21) placed at equal intervals along the outer peripheral surface of the disk-shaped top chuck (12); and by means of an angle-adjusting cam member (23), presses a rotation-assisting member (22) provided on the outer peripheral surface of the top chuck (12), rotates the top chuck (12) in the horizontal plane, and aligns the position of wafer (W2) relative to the position of wafer (W1).