PCB ASSEMBLY AND MANUFACTURING METHOD THEREFOR AND MICRO-TACT SWITCH USING PCB ASSEMBLY

摘要

The present invention relates to a micro-tact switch using a PCB assembly having a highly reliable, waterproof and dustproof structure, comprising: a PCB assembly formed to bend at both side ends facing each other; a knob a knob which is provided to press the inside of the PCB assembly; a base provided with a loading surface such that the bent both sides of the PCB assembly are loaded and supported thereon, and having an accommodation space for accommodating the PCB assembly and the knob; and a cover and a cover layer which are respectively coupled with one side and the other side of the base to prevent the separation of the PCB assembly and the knob from the accommodation space in the base, wherein the PCB assembly comprises: a soft printed circuit board (PCB) having patterns printed on opposite surfaces thereof to be electrically connected to each other, and an accommodation groove formed on a center thereof; a dome-shaped contact loaded in the accommodation groove and is electrically connected to the patterns by the pressure of the knob; an adhesive film stacked on an edge of the soft PCB; and an insulating film stacked on the adhesive film to insulate the contact from the outside. Therefore, the present invention can obtain a highly reliable, waterproof and dustproof structure by: primarily blocking foreign substances, moisture, and the like through the combination of the base, the cover, and the cover layer; secondarily blocking foreign substances, moisture, and the like through the close contact between the bent portion and the loading surface of the PCB assembly due to the C-shape of the PCB assembly; and thirdly blocking foreign substances, moisture, and the like through the insulating film molded on the PCB assembly using thermal compression bonding.