RFI shielding for volume manufacture - PCB enclosure design, manufacture and assembly need to be considered early in equipment design to avoid costly modifications and delays in bringing the product to market

摘要

WITH THE PROLIFERATION of electronics, especially wireless and radio applications, in all areas of everyday life, the need for reducing radiated interference between equipment, subassemblies, and individual PCB circuits grows apace. Consequently, shielding and its effect on the manufacturing process must be considered a valid design parameter - one that must be considered on an equal footing with other design goals from the earliest stages of product design. Such a foresighted approach allows designers to sidestep the trap of costly modifications to PCB layouts at the latter stages of the design process. Issues that must be considered include shielding and its effect on the manufacturing process, handling of shielding during PCB assembly, packaging, and the mandated change to non-lead solders.