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Method and device for processing workpieces which use conoscopic holography

机译:使用锥光全息术加工工件的方法和装置

摘要

The method involves clamping a workpiece in a processing machine i.e. precision grinding machine, and measuring a surface area of the workpiece using an optical measuring device (30) e.g. laser triangulation sensor, in a contactless manner while the workpiece is clamped in the machine. The workpiece is processed, and a product is accurately measured. Measurement data corresponding to the measured product is utilized for manufacturing additional products. The data is stored and utilized as control data for processing the workpiece and as reference data for measuring the processed workpiece. An independent claim is also included for a device for processing a workpiece.
机译:该方法包括将工件夹持在加工机即精密研磨机中,并使用光学测量装置(30)例如光学测量装置(30)来测量工件的表面积。激光三角测量传感器,以非接触方式将工件夹紧在机器中。加工工件,并精确测量产品。对应于被测产品的测量数据被用于制造其他产品。数据被存储并用作用于处理工件的控制数据和用于测量处理后的工件的参考数据。还包括用于处理工件的设备的独立权利要求。

著录项

  • 公开/公告号EP2535142A1

    专利类型

  • 公开/公告日2012-12-19

    原文格式PDF

  • 申请/专利权人 L. KELLENBERGER & CO. AG;

    申请/专利号EP20120006089

  • 发明设计人 HONEGGER DANIEL;

    申请日2008-08-18

  • 分类号B24B19/08;B24B49/12;B23Q17/24;G01B9/021;

  • 国家 EP

  • 入库时间 2022-08-21 16:31:44

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