首页> 外国专利> Housing for an electrical device, method for producing such a housing, electrical device with such a housing and use of such a device for an electrical device

Housing for an electrical device, method for producing such a housing, electrical device with such a housing and use of such a device for an electrical device

机译:用于电气设备的壳体,用于制造这种壳体的方法,具有这种壳体的电气设备以及这种设备在电气设备中的用途

摘要

The housing has a housing base body (10) metalized on an three-dimension (3D) structured outer surface and a 3D structured inner surface using a physical vapor deposition process in a contactless manner. A metallic layer (12) is formed on the outer surface and the inner surface. The housing is made of plastic. The metallic layer has a thickness of a value of specific micrometers. Housing parts, housing shells and a housing cover are combined to form an electrical device. The base body is provided with planar surface sections. An independent claim is also included for a method for manufacturing a housing.
机译:该壳体具有壳体基体(10),该壳体基体(10)使用物理气相沉积工艺以非接触方式镀在三维(3D)结构化外表面和3D结构内表面上。在外表面和内表面上形成金属层(12)。外壳由塑料制成。金属层的厚度为特定的微米。壳体部件,壳体外壳和壳体盖被组合以形成电气装置。基体设有平坦的表面部分。还包括一种用于制造壳体的方法的独立权利要求。

著录项

  • 公开/公告号EP2645831A1

    专利类型

  • 公开/公告日2013-10-02

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号EP20120162376

  • 发明设计人 HOFFMANN INGOLF;

    申请日2012-03-30

  • 分类号H05K5/00;

  • 国家 EP

  • 入库时间 2022-08-21 16:28:46

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